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Welcome from the General Co-Chairs

It is our pleasure to welcome attendees to the 3rd IEEE International Symposium on Wireless Vehicular Communications (IEEE WiVeC2010).

After the successful first and second WiVeC editions in 2007 (Baltimore) and 2008 (Calgary), the third IEEE WiVeC symposium will be co-located with the 71th IEEE Vehicular Technology Conference 2010 Spring conference and will take place at the Grand Hotel in Taipei on the 16th and 17th of May 2010. VTC Fall editions are traditionally located in North America, while VTC Spring is located in other areas of the world. Since WiVeC was originally launched co-located with VTC Fall editions, the IEEE Vehicular Technology Society decided that WiVeC would take place every year and a half in order to ensure that the conference is alternatively co-located with VTC Fall and Spring editions. This resulted in there being no WiVeC edition in 2009.

The papers to be presented at IEEE WiVeC2010 cover the full range of wireless vehicular communications: physical layer; protocol design; security and applications and systems. As it has been a tradition since the first WiVeC edition, IEEE WiVeC2010 will also host a series of wireless vehicular communications demos and invited speakers.

We would like to thank all authors who submitted their work to WiVec, as well as the TPC members and external reviewers for providing timely and high quality reviews. Finally, we would like to take this opportunity to thank the work and dedication of all the organizing and technical committee, and the support from the IEEE Vehicular Technology Society.

Welcome from the Technical Program Co-Chairs

Welcome to WiVeC2010 in Taipei! The Technical Program Committee has prepared an exciting program of technical presentations covering the wireless vehicular communication area. We have accepted a total of 21 papers and 4 demos from 68 submitted papers. Our objective has been to propose a technical program with papers covering the full range of wireless communications in vehicular environment: physical layer area; protocol design area; security area; and applications, systems and experiments area.

We would like to express our gratitude to all authors who submitted their work to IEEE WiVeC2010 and will, by their presence and expertise, contribute to the success of this third edition of WiVeC. All submitted papers have been thoroughly and independently reviewed in accordance with standard blind reviewing practices. Each of the submitted papers was assigned to at least 3 reviewers.

The review process is a real community effort, and we were very fortunate to have a dedicated group of people, from local and international experts, serving as the technical program committee members who spent their valuable time in providing reviews and drafting the external reviews. In total we had 41 TPC members, and the majority of review tasks had been conducted directly by TPC members and executive committee members. We would therefore like to thank the TPC members and the additional external reviewers for having provided timely and high quality reviews to
complete this enormous task.

We would like to thank Shie-Yuan Wang and Javier Gozalvez for their excellent work as WiVeC general co-chairs, the Demo Chair, Giovanni Pau, for his effort in attracting exciting demos, and last but not least, James Irvine for his invaluable advice and help.